This phosphorus-containing, low-melting hard solder is known for its excellent flow properties, making it ideal for joining copper with copper or copper-based materials. Key features and specifications include:
Features and Applications
Material Compatibility:
Suitable for copper and copper-based materials.
Not suitable for steels (Fe) and nickel alloys due to brittle phase formation.
Not recommended for use in sulphurous media.
Usage in Various Industries:
Installation technology
Electronics industry
Refrigeration and air conditioning technology
Effective in refrigeration industry applications down to -50°C.
Suitable for flame soldering, induction heating, and protective gas furnaces.
Technical Specifications
Standards:
ISO 17672 (CuP 179)
DIN EN 1044 (CP 203)
DVGW worksheets GW 2 and GW 7
Certified with DVGW test mark (DW-0105CL0476) and the quality mark of Gütegemeinschaft Kupferrohr eV.
Composition:
Copper (Cu): Balance
Phosphorus (P): 6.2%
Permissible Contamination (max. % by weight):
Aluminum (Al): 0.01%
Bismuth (Bi): 0.030%
Cadmium (Cd): 0.01%
Lead (Pb): 0.025%
Zinc (Zn): 0.05%
Combined Zn + Cd: 0.05%
Total Contamination (max. % by weight): 0.25%
Physical Properties:
Melting Range: 710-890°C
Working Temperature: 760°C
Density: 8.1 g/cm³
Tensile Strength (DIN EN 12797): 250 MPa for Cu
Strain: 5%
Operating Temperature of the Solder Joint: Max. 150°C (without loss of strength)
